1. Optical accuracy≤ 10 μm
2. Processing layer thickness: the minimum processing layer thickness ≤ 10 μm 
3. Maximum processed sample size: processed sample size≥ 90×90 mm
4. Minimum size of two-dimensional processing: the minimum line width of two-dimensional machining ≤ 12 μm
5. Minimum size of three-dimensional machining: the minimum feature size of three-dimensional machining ≤ 50 μm
6. Ultimate machining capacity of complex structure: the smallest cone tip ≤ 15 μm; Minimum pore size≤ 50 μm; Minimum spring structure wire diameter ≤ 100 μm 
7. Processing material: 405 nm curing band of universal photosensitive resin, can support the printing of high temperature resistant resin (heat deflection temperature @ 0.45 MPa, above 140 °C), high viscosity resin (up to 20000cps@25 °C), functional particle composite resin and other materials
8. Printing technology: applying projection micro-stereolithography 3D printing technology to achieve ultra-high-precision micro-scale 3D printing, top-down projection, ultraviolet light to project ultrafine patterns to the surface of liquid resin to solidify, layer by layer accumulation to complete the production of products.

High accuracy: 10 μm
Large size: 100 mm(L)*100 mm(W)*75 mm(H)

Operators must be trained before using it